Simultaneously enhancing heat transfer ability, thermal expansion matching and thermal stability of diamond-reinforced Cu matrix composites through multi-level …
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W Huang, G Yuan, Z Jiao, J Wu, Y Yao, K Zhou…
Materials Today …, 2025
Elsevier
Although diamond-reinforced Cu matrix (diamond/Cu) composites can achieve high thermal conductivity (TC) via interface modification, the significant mismatch in the coefficient of thermal expansion (CTE) between these composites and semiconductors, along with the degradation of heat transfer performance during long-term service, severely impedes their engineering applications. In this work, inspired by the concept of elemental interdiffusion, a novel interface design strategy combined with the control of the interface layer thickness was …
