Interconnect Reliability in Advanced Memory Device Packaging: ISBN: 978-3-031-26707-9 (Print), 978-3-031-26708-6 (Online)
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CL Gan, CY Huang
2024
Taylor & Francis
Interconnect Reliability in Advanced Memory Device Packaging, presents good technical insights of mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing and integration technologies and applications, which is suitable for both industry engineering and academic practitioners. Power device packaging is playing an increasingly critical role in the transition to higher power densities, enabling more efficient power supplies, power delivery, and faster conversion, as well as …
