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期刊论文An Acceleration Model for Sn-Ag-Cu Solder Joint Reliability Under Various Thermal Cycle Conditions复制

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其他信息:

出版社: Surface Mount Technology Association
作者: N. Pan; G. A. Henshall; F. Billaut; S. Dai; M. J. Strum; R. Lewis; E. Benedetto; J. Rayner

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