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Research on the Failure Mechanism of TSV Interconnection Structure in RF Microsystem under Temperature Stress复制

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W Tian, Y Xie, X Yang, W Yang, F Tang…
… Technology (ICEPT), 2025
ieeexplore.ieee.org
… By integrating experimental data with simulations, this paper systematically investigates the failure mechanisms of TSV structures under temperature stress, providing valuable …

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