Electroless Copper Metallization on Glass: Challenges, Strategies, and Applications for Next‐Generation Electronics Packaging
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DOI: 10.1111/jace.70704
文献链接: https://ceramics.onlinelibrary.wiley.com/doi/10.1111/jace.70704
其他信息:
出版社: Wiley
作者: Mustehsin Ali; Xin Zhuo; Jun Li; Ling Wang; Yuxiang Huang; Honglei Wang; Mao Zhang; Xinyun Wang; Binghui Deng
全文下载地址: https://ceramics.onlinelibrary.wiley.com/doi/pdf/10.1111/jace.70704

