MEMS Failure Analysis In Wafer Fabrication
DOI: 10.31399/asm.cp.istfa2016p0188
文献链接: https://dl.asminternational.org/istfa/proceedings/ISTFA2016/81368/188/12067
其他信息:
出版社: ASM International
作者: Hui Peng Ng; Angela Teo; Ghim Boon Ang; Alfred Quah; N. Dayanand; Naiyun Xu; Chang Qing Chen; Zhi Hong Mai; Jeffrey Lam
全文下载地址: http://dl.asminternational.org/istfa/proceedings-pdf/doi/10.31399/asm.cp.istfa2016p0188/416126/istfa2016p0188.pdf

