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期刊论文Transient Electrical-Thermal-Mechanical Coupling Model and Short-Circuit Failure Analysis of Wire-Bonded IGBT Module复制

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出版社: IEEE
作者: Renkuan Liu; Xiaorong Luo; Jie Wei; Yan Huo; Gaoqiang Deng; Yuxi Wei; Hui Li; Zeyu Duan; Xianping Chen

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