Photosensitive polyimide with high pattern stability and low thermal expansion coefficient based on poly (amic acid) containing dual cross-linked groups
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DOI: 10.1177/09540083251322534
文献链接: https://journals.sagepub.com/doi/10.1177/09540083251322534
其他信息:
出版社: SAGE Publications
作者: Lei Zhou; Shengyu Chen; Chentao Fei; Yonggang Min
全文下载地址: https://journals.sagepub.com/doi/pdf/10.1177/09540083251322534

