当前位置：首页 > 文献互助 > 互助详情

期刊论文Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip Packaging复制

用户wNWatK5Onu60 1小时前 9 待确认帖子自动结束时间: 2026-01-20 10:10:08

1. 请及时下载文件确认是否正确, 系统将在 2026-01-22 11:46:05 删除文件

2. 如若文件有误请驳回应助文件, 求助状态即回到求助中

3. 如若文件正确请及时点击确认, 若超过时后系统自动默认为已完结

注: 所有应助的资源仅供学习交流使用, 不得违反相关法律法规

其他信息:

出版社: IEEE
作者: Gui Chen; Yan Wang; Xiaoyu Xiao; Yamei Yan; Wenhui Zhu

互助时间线

追逐梦想上传了文件(pdf 3.47 MB), 求助状态变成待确认

Recycled leather–epoxy hybrid composites exhibiting novel fracture behavior identified through multimodal characterization 1分钟前

Advances in Melt-Electrowriting of Fibrous Bioscaffolds: A High-Resolution Manufacturing Strategy for Tissue Regeneration 1分钟前

High-speed spinning of collagen microfibers comprising aligned fibrils for creating artificial tendons 2分钟前

One-Pot Crosslinking Enables 3D Printing of Shear-Recovery Fish Collagen VEGF-Functionalized Inks 10分钟前

Design of efficient dispase one-bath strategy with low pollution and life cycle assessment for eco-sustainable leather processing 18分钟前

Hidden length lets collagen buffer mechanical and chemical stress 19分钟前

Hidden length lets collagen buffer mechanical and chemical stress 25分钟前

Nucleotide distribution analysis of 5′UTRs in genome-scale directs their redesign and expression regulation in yeast 25分钟前

Exploration of LPS2 agonist binding modes using the combination of a new hydrophobic scaffold and homology modeling 32分钟前

Anthracene and Pyrene Derivatives as Blue Fluorophores: Synthesis, Characterization and Photophysical Properties 48分钟前