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期刊论文Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition复制

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出版社: Elsevier BV
作者: Shengli Li; Chunjin Hang; Wei Zhang; Qilong Guan; Xiaojiu Tang; Dan Yu; Ying Ding; Xiuli Wang

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