High thermal conductivity copper/graphene composites for efficient thermal management
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F Wang, C Ye, H Yin, S Pan, K Liu, Y Zhu
Carbon, 2025
Elsevier
Copper (Cu) has been widely used in thermal management, but the thermal conductivity is limited to∼ 387 W m− 1 K− 1. Highly ordered graphene films (GFs) demonstrate a thermal conductivity of∼ 1800 W m− 1 K− 1 in the plane, but the structural reliability and the machinability remain challenges due to the weak interface interaction between graphene layers. Herein, we report a cost-effective yet readily scalable preparation of inch-scale copper/graphene film/copper (Cu/GF/Cu) sandwich composites for efficient heat dissipation …
