diamond heterogeneous integration for thermal management—integration strategies and advanced packaging
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S Wu, F Wu, J Zhang, J Ji, W Zhang, W Luo…
Journal of Materials …, 2026
Springer
The increasing power density of advanced semiconductor devices and three-dimensional integrated systems has made thermal management a key challenge for next-generation electronics. Owing to its ultrahigh thermal conductivity, excellent electrical insulation, and outstanding thermo-mechanical stability, diamond has become a promising material for heat dissipation and heterogeneous integration. Existing reviews mainly focus on isolated topics, such as thermal interface materials, bonding technologies, or individual device applications …
